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The test system of claim 3, wherein the resistive heating mechanism comprises: a heater containing the conductive traces and a gasket structure for holding the instrument module, the gasket structure being thermally-conductive and comprising one or more waveguides to conduct heat relative to the instrument module, the gasket structure being between the heater and part of the instrument module.ĥ. The test system of claim 1, wherein the heating mechanism comprises a resistive heating mechanism, the resistive heating mechanism comprising conductive traces contained in the resistive heating mechanism to generate heat.Ĥ. The test system of claim 1, wherein the top surface and the bottom surface face in opposite directions, the heating mechanism being on a side of the top surface and the cooling mechanism being on a side of the bottom surface.ģ. A test system comprising: a heating mechanism a cooling mechanism and an instrument module comprising one or more interfaces to receive signals from a device under test (DUT), the DUT being external to the instrument module, the instrument module comprising one or more electrical components to affect the signals, the instrument module being between the heating mechanism and the cooling mechanism wherein the heating mechanism is configured to apply heat to a top surface of the instrument module, and the cooling mechanism is configured to cool a bottom surface of the instrument module, the heating mechanism and the cooling mechanism are configured to operate to maintain the instrument module within a target temperature range, and the top and bottom surfaces are relative to ground.Ģ. Temperature control device for an electronic componentĪpparatus, method and system of liquid-based, wide range, fast response temperature control of electronic deviceġ. Temperature and condensation control system for functional testerĮlectro-optic system controller and method of operation Thermal transferring member, test board and test apparatus Systems and Methods for Cooling in a Thermal Cycler METHOD AND APPARATUS FOR THERMALLY CONDITIONING PROBE CARDS

TEST JIG AND SEMICONDUCTOR DEVICE TEST METHOD COOLING/HEATING MODULE AND AIR CONDITIONING DEVICE